THE GLOBAL MEMS DEVICE, EQUIPMENT, AND MATERIALS MARKETS: FORECASTS AND STRATEGIES FOR VENDORS AND FOUNDRIES

Chapter 1 The MEMS Market Infrastructure 1-1

Chapter 2 Forecast Of The Key Applications And Markets 2-1

2.1 MEMS Device Market Forecast 2-1
2.1.1 Ink Jet Head 2-3
2.1.2 Pressure Sensor 2-6
2.1.3 Silicon Microphone 2-8
2.1.4 Accelerometer 2-13
2.1.5 Gyroscope 2-17
2.1.6 Micro Display 2-20
2.1.7 Other MOEMS 2-24
2.1.8 Microfluidics 2-28
2.1.9 RF MEMS 2-31
2.1.10 Digital Compass 2-35
2.1.11 Inertial Sensor 2-37
2.1.12 Emerging Applications 2-39
2.2 MEMS System Market Forecast 2-42
2.2.1 Automotive Systems 2-48
2.2.2 Aeronautics Systems 2-50
2.2.3 Consumer Systems 2-52
2.2.4 Defense Systems 2-54
2.2.5 Industrial Systems 2-56
2.2.6 Medical/Life Sciences Systems 2-58
2.2.7 Telecom Systems 2-60

Chapter 3 Markets for Equipment and Materials Suppliers 3-1

3.1 Introduction 3-1
3.2 MEMS Equipment Markets 3-2
3.2.1 Assembly 3-4
3.2.2 Bonding 3-7
3.2.3 Cleaning 3-10
3.2.4 Deposition 3-12
3.2.5 Dicing 3-18
3.2.6 Etching 3-20
3.2.7 Laser Micromachining 3-26
3.2.8 Lithography 3-31
3.2.9 Metrology/Inspection 3-36
3.2.10 Testing 3-39
3.2.11 Thermal Treatment 3-42
3.2.12 Wafer Thinning 3-44
3.3 MEMS Material Markets 3-47
3.3.1 Chemicals 3-47
3.3.2 Photomasks 3-50
3.3.3 Substrates 3-53

Chapter 4 MEMS Foundries 4-1

4.1 Foundry Profiles and Strategies 4-1
4.1.1 Advanced Microsensors 4-3
4.1.2 Agiltron 4-3
4.1.3 Asia Pacific Microsystems 4-4
4.1.4 Beijing First MEMS 4-4
4.1.5 Bosch 4-5
4.1.6 China Resources Semiconductor 4-5
4.1.7 Colibrys 4-6
4.1.8 C2V 4-7
4.1.9 Dai-Nippon Printing 4-7
4.1.10 Dalso 4-8
4.1.11 Freescale 4-9
4.1.12 GLOBALFOUNDRIES 4-9
4.1.13 Honeywell MEMSplus 4-10
4.1.14 Infineon Technologies SensoNor As 4-10
4.1.15 Institute of Microelectronics 4-11
4.1.16 Innovative Micro Tech 4-12
4.1.17 Integrated Sensing Systems Inc. (ISSYS) 4-13
4.1.18 LioniX 4-13
4.1.19 MEMS Engineering and Material 4-14
4.1.20 MEMSCAP 4-14
4.1.21 Micralayne 4-15
4.1.22 Micrel 4-15
4.1.23 Midwest MicroDevices, LLC 4-16
4.1.24 Nanostructures Inc 4-16
4.1.25 Norcada Inc. 4-17
4.1.26 Olympus 4-17
4.1.27 Omron 4-18
4.1.28 Proton Mikrotechnik 4-19
4.1.29 Semiconductor Manufacturing International Corporation 4-19
4.1.30 SEMEFAB 4-20
4.1.31 Silex Microsystems 4-20
4.1.32 Sony 4-20
4.1.33 ST Microelectronics 4-21
4.1.34 Taiwan Semiconductor Manufacturing Co Ltd (TSMC) 4-21
4.1.35 Texas Instruments 4-22
4.1.36 Touch Microsystems 4-22
4.1.37 Tronics Microsystems 4-23
4.1.38 X-Fab 4-24
4.2 Small-Mid-Sized Companies 4-25

Chapter 5 Factors for Foundry Success 5-1

5.1.1 Achieving Economies Of Scale 5-1
5.1.2 Competitive Advantages 5-2
5.1.3 Core Strengths 5-3
5.1.4 Employee Commitment 5-3
5.1.5 Expansion Plans 5-3
5.1.6 Financial Objectives: 5-4
5.1.7 Groundbreaking MEMS Solutions 5-4
5.1.8 In- House Expertise in MEMS Testing And Reliability 5-4
5.1.9 Leadership in Technology 5-5
5.1.10 Manufacturing Excellence 5-5
5.1.11 Manufacturing Process 5-7
5.1.12 Mastering Process and Production Technology 5-7
5.1.13 Patent Protection 5-7
5.1.14 Partnerships 5-8
5.1.15 Products 5-8
5.1.16 Proprietary Development Processes 5-9
5.1.17 Sales Organization 5-9
5.1.18 Sales Process and Customer Base 5-9
5.1.19 Strong Customer Relations 5-10
5.1.20 Vision and Goal 5-10

Chapter 6 Critical MEMS Issues 6-1

6.1 3-D Interconnects and Packaging 6-1
6.2 Wafer Size 6-12
6.3 MEMS Testing 6-15
6.4 Opportunities For Fabless MEMS Companies 6-19

List Of Tables

4.1 Top MEMS Foundries by Revenues 4-2

List of Figures

2.1 MEMS Markets 2-2
2.2 Ink Jet Head Sales Forecast 2-5
2.3 Pressure Sensor Sales Forecast 2-7
2.4 Silicon Microphone Sales Forecast 2-12
2.5 Accelerometer Sales Forecast 2-16
2.6 Gyroscope Sales Forecast 2-19
2.7 Micro Display Sales Forecast 2-23
2.8 Other MOEMS Sales Forecast 2-27
2.9 Microfluidics Sales Forecast 2-30
2.10 RF MEMS Sales Forecast 2-34
2.11 Digital Compass Sales Forecast 2-36
2.12 Inertial Sensor Sales Forecast 2-38
2.131 Emerging Applications Sales Forecast 2-41
2.12 Automotive System Sales Forecast 2-49
2.15 Aeronautics System Sales Forecast 2-51
2.16 Consumer System Sales Forecast 2-53
2.17 Defense System Sales Forecast 2-55
2.18 Industrial System Sales Forecast 2-57
2.19 Medical System Sales Forecast 2-59
2.20 Telecom System Sales Forecast 2-61
3.1 Discrete Assembly of MEMS 3-5
3.2 Assembly Equipment Sales Forecast 3-6
3.3 Bonding Equipment Sales Forecast 3-9
3.4 Cleaning Equipment Sales Forecast 3-11
3.5 Deposition Equipment Sales Forecast 3-17
3.6 Dicing Equipment Sales Forecast 3-19
3.7 Schematic Of DRIE 3-22
3.8 Etching Equipment Sales Forecast 3-25
3.9 Laser Micromachining Equipment Sales Forecast 3-30
3.10 Driving Principle Of The MOR (a) Parallel State (B) Tilted State 3-33
3.11 Lithography Equipment Sales Forecast 3-35
3.12 Metrology/Inspection Equipment Sales Forecast 3-38
3.13 Testing Equipment Sales Forecast 3-41
3.14 Thermal Treatment Equipment Sales Forecast 3-43
3.15 Wafer Thinning Equipment Sales Forecast 3-46
3.16 Chemicals Sales Forecast 3-49
3.17 Photomasks Sales Forecast 3-52
3.18 Substrates Sales Forecast 3-54
3.19 Wafer Starts By Substrate Size 3-56
6-1 Process For Capping MEMS 6-5
6-2 Examples Of Thermoplastic Cavity Packages 6-6
6.3 Fluidic Packaging System 6-8
6.4 Forecast of Wafer Size 6-14
6-5 Fluidic Packaging System 6-18